onsemi (Nasdaq: ON), a leader in intelligent power and sensing technologies,
today announced a trio of silicon carbide (SiC) based power modules in
transfer molded technology that are intended for use in on-board charging
and high voltage (HV) DCDC conversion within all types of electric vehicles
(xEV). The APM32 series is the first-of-its-kind that adopts SiC technology
into a transfer molded package to enhance efficiency and shorten charge time
of xEVs and is specifically designed for high-power 11-22kW on-board
chargers (OBC).
Each of the three modules exhibits low conduction and switching losses,
combining with best-in-class thermal resistance and high voltage isolation
to deal with 800V bus voltage. The enhanced efficiency and lower heat
generation ultimately allow for a more powerful OBC. One that can charge the
xEV faster and increase its operating range – two critical factors for
consumers.
“Our new modules employ the latest SiC technology to minimize losses and
overall system volume, allowing designers to meet charging efficiency and
space goals,” said Fabio Necco, vice president and general manager,
Automotive Power Solutions at onsemi. “By adopting the pre-configured
modular format, designers are able to configure their designs faster, with
significantly lower time to market and design risk.”
Taking advantage of onsemi’s end-to-end SiC supply chain capability and
proven SiC MOSFETs and diodes, the APM32 modules offer high levels of
reliability, and each module is serialized for full traceability. The
modules can operate with junction temperatures (Tj) as high as 175°C,
ensuring reliability even in challenging, space-constrained automotive
applications.
“APM32 provides a differentiated solution for our customers by leveraging
onsemi’s best-in-class packaging to unleash the full capability of the
leading-edge silicon carbide technology,” said Simon Keeton, executive vice
president and general manager, Power Solutions Group at onsemi. “In
addition, we know our customers value supply assurance, which our end-to-end
SiC supply chain capabilities provide.”
Two modules of the APM32 series, NVXK2TR40WXT and NVXK2TR80WDT, are
configured in H-bridge topology with a breakdown (V(BR)DSS) capability of
1200 V, ensuring suitability for high voltage battery stacks. They are
designed to be used in the OBC and HV DCDC conversion stages. The third
module, NVXK2KR80WDT, is configured in Vienna Rectifier topology and used in
the power factor correction (PFC) stage of the OBC. There will be six-pack
and full-bridge modules in the near future to complete the SiC OBC
portfolio.
All three modules are housed in a compact and robust Dual Inline Package
(DIP), which ensures low module resistance. The top cool and isolated
features meet the most stringent automotive industry standards. The creepage
and clearance distances meet IEC 60664-1 and IEC 60950-1. Additionally, the
modules are qualified to AEC-Q101 and AQG 324 for automotive use.
About onsemi
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better
future. With a focus on automotive and industrial end-markets, the company
is accelerating change in megatrends such as vehicle electrification and
safety, sustainable energy grids, industrial automation, and 5G and cloud
infrastructure. onsemi offers a highly differentiated and innovative product
portfolio, delivering intelligent power and sensing technologies that solve
the world’s most complex challenges and leads the way to creating a safer,
cleaner, and smarter world. onsemi is recognized as a Fortune 500® company
and included in the S&P 500® index. Learn more about onsemi at
www.onsemi.com.
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