DSP Concepts, the Audio of Things category leader and the creator of the
Audio WeaverR development platform, has been chosen by LG Electronics (LGE)
as the AI Sound technology partner for the automotive industry.
“Based on our successful collaborations with DSP Concepts for LGE’s premium
consumer electronics products, we are looking forward to strengthening our
leading audio technology brand by expanding adoption of the Audio Weaver
platform for the automotive industry”
“Based on our successful collaborations with DSP Concepts for LGE’s premium
consumer electronics products, we are looking forward to strengthening our
leading audio technology brand by expanding adoption of the Audio Weaver
platform for the automotive industry,” said Jeonghyu Yang, Vice President,
Leader of the SoC Fundamental Technology Lab at CTO Division in LGE. “Audio
Weaver gives automotive OEMs a fully optimized, hardware-independent audio
framework that streamlines the integration of advanced processing algorithms
making it easy to enhance the audio experience for drivers and passengers.”
The two companies plan to continue the collaboration to make additional
machine learning-powered audio algorithms from LGE available on Audio
Weaver, and will endeavor to collaborate on future technologies aimed at
delivering remarkable new audio experiences.
“Recent technological advancements in the automotive industry, especially in
electric vehicles, have led to exciting new innovations in automotive
audio,” said Chin Beckmann, CEO and co-founder of DSP Concepts. “With Audio
Weaver, car makers can access leading-edge LGE algorithms like AI Sound to
build a fully orchestrated immersive sound environment in the cabin.”
A demonstration of AI Sound running on the Audio Weaver platform will debut
live at the Automotive Audio Conference hosted by the AES (Audio Engineering
Society) in Detroit from June 8 – 10.
For more information on DSP Concepts’ products and services please visit
https://w.dspconcepts.com/.
About DSP Concepts, Inc.
DSP Concepts is the Silicon Valley-based leader in the Audio of Things (AoT)
market and the creator of Audio Weaver, the audio experience design platform
that makes audio innovation easy. DSP Concepts equips and supports engineers
with real-time workflows to quickly stand up prototypes, collaborate and
modify designs across teams, and deploy to the most popular chipsets from
leading semiconductor companies including Analog Devices, MediaTek, NXP
Semiconductors, Qualcomm, STMicroelectronics, Cadence Design Systems, Arm,
and others. DSP Concepts technologies are embedded in millions of automotive
and consumer products, delivering remarkable audio experience solutions to
prestigious brands including Bang & Olufsen, BMW, Braun, Facebook, Garmin,
GoPro, LG, Mercedes Benz, Panasonic, Peloton, Porsche, Samsung, Sennheiser,
Spotify, Tesla, and many more.
“Audio Weaver” is a registered trademark of DSP Concepts, Inc. DSP Concepts
is a trademark of DSP Concepts, Inc. Trade names, trademarks and service
marks of other companies appearing in this press release are the property of
their respective holders.
More Stories
Mosaic Click board from MIKROE delivers global coverage multi-band and multi-constellation tracking ability
Current transducer from Danisense selected for DC charging station testing device demonstrator at TU Graz
New Click board from MIKROE helps develop and train ML models for vibration analysis