Integral Adds New Composite to its ElectriPlastic Line of Conductive Hybrid Plastics

Integral Technologies, Inc., an emerging leader in hybrid-conductive plastics, announced today the immediate availability of ElectriPlast™-CF66, a new electrically conductive, resin-based material that has been engineered to meet demanding electro-magnetic shielding, thermal requirements and mechanical properties for automotive, marine and aerospace applications.

ElectriPlast CF66 outperformed aluminum while delivering a 50 to 60% reduction in weight

Composed of polyamide (PA) 66 and nickel-plated carbon fiber, EP-CF66 cuts traditional component weight in half and is lighter than other conductive plastics in the industry. Its extensive development and third-party testing was largely conducted in conjunction with Tier One suppliers intent on expanding into this field by improving the physical and performance characteristics of their products through the utilization of ElectriPlast technology.

EP-CF66 is a cost-effective solution that is ideal for electromagnetic shielding in engine compartments as well as other harsh environments in a wide range of industries. Its high mechanical strength withstands very high temperatures, the corrosiveness of fluids and high frequency vibrations.

“Our newest composite, ElectriPlast-CF66, is a result of extensive research and development and many collaborative hours with our OEM clients,” states Bill Robinson, CEO of Integral. “The material is lighter than previous blends, provides the same shielding and is structurally stronger. Parts molded with ElectriPlast-CF66 outperformed aluminum at certain frequencies while delivering a 50 to 60% percent reduction in weight. This is a significant new product for us and a true advancement in electrically conductive hybrid plastics.”

EP-CF66 is the latest addition to Integral’s expanding line of ElectriPlast composites, a family of non-corrosive, electrically conductive, resin-based materials whose properties can be molded into any shape or size associated with plastics, rubbers and other polymers. With continued innovation and the newest release of EP-CF66, Integral has broadened its portfolio to offer a wide spectrum of electrically conductive hybrid plastics for nearly every application and every market.
“ElectriPlast™-CF66 is a customer-tested product that was praised for its durability, functionality and light-weight composition,” added Mo Zeidan, CTO of Integral. “Not only does it offer a weight advantage over other conductive plastics in the industry, but its mechanical properties are far superior.”
Industries from automotive to electronics and consumer goods are seeking light-weight component solutions to meet consumer demand for lighter, more portable products and as a means to comply with stricter government fuel standards and greenhouse emissions.

Integral’s patent and IP library has been recognized as “One of the 50 Best & Brightest Companies” by MDB Capital, while ElectriPlast has been recognized as “Best of What’s New” by Popular Science and “Best Innovation” by Innovations International CES.
Integral Technologies

Integral Technologies, Inc. (OTCBB: ITKG) (“Integral”), (http://www.electriplast.com) engages in the discovery, development, and commercialization of electrically conductive hybrid plastics used primarily as raw materials in the production of industrial, commercial and consumer products and services worldwide. Its core material, ElectriPlast, is a non-corrosive, electrically conductive resin-based material whose properties allow it to be molded into any of the infinite shapes and sizes associated with plastics, rubbers and other polymers while reducing component weight by 40 to 60%. Integral is a leader in conductive hybrid plastics with a broad Intellectual Property portfolio referencing its ElectriPlast technology. Applications for ElectriPlast include: Shielding Wire, Power Electronics, Connectors, and Cables; Shielding , Conduction, Batteries, Semiconductors, Heated Elements, Sensors, Antennas, Medical Devices, Consumer Electronics and Acoustics, Fuses, Capacitors, Resistors, RFID, Busbars and Terminals.